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作 者:钱澄源 艾永昌 苏童 周超[2] 刘兴光 侯雪玲[1] QIAN Chengyuan;AI Yongchang;SU Tong;ZHOU Chao;LIU Xingguang;HOU Xueling(School of Materials Science and Engineering,Shanghai University,Shanghai 200072,China;Science and Technology on Vacuum Technology and Physics Laboratory,Lanzhou Institute of Physics,Lanzhou 730000,China)
机构地区:[1]上海大学材料科学与工程学院,上海200072 [2]兰州空间技术物理研究所真空技术与物理重点实验室,兰州730000
出 处:《真空与低温》2020年第2期101-107,共7页Vacuum and Cryogenics
基 金:国家自然科学基金国家重大科研仪器研制项目(61627805);真空技术与物理重点实验室基金(HTKJ2019KL510006)。
摘 要:对于MEMS(Micro-electro-mechanical Systems)芯片器件,特别是单兵作战用的红外热辐射仪等传感器,吸气材料的吸气动力学、吸气热力学等参数对其MEMS芯片的稳定性、安全性、灵敏性和寿命至关重要。以Zr0.9Ti0.1V2为基体合金,采用快速凝固法和稀土元素Ce合金化法,研究了不同快淬速度和Ce元素的添加对快淬带的微观组织结构和相结构的影响,模拟MEMS器件真空封装工艺条件和真空封装后腔体的环境,测试了Zr0.9-xTi0.1V2Cex(x=0,0.025、0.05、0.075、0.1)合金快淬带的吸气性能等参数。结果表明,较高的快淬速度和适量Ce的添加能够有效地细化晶粒和减少Zr0.9-xTi0.1V2Cex快淬带中氧化物相Zr3V3O的生成提高吸气材料在制备过程中的抗氧化性。当Ce的含量为0.05时,快淬带具有较好的吸氢性能,可使模拟MEMS器件工作环境的压力达到1×10-3 Pa以下。Ce的加入使PCT(压力-组分-温度)曲线的平台更为平坦宽化,固溶氢气的稳定性提高,吸氢量增大。Zr0.85Ti0.1V2Ce0.05快淬带具有较大的焓变值,与H结合能力强,更易吸氢。根据Van’t Hoff关系外推出快淬带室温下的平台压力在10-14~10-13 Pa之间,提高了器件的稳定性。Zr0.85Ti0.1V2Ce0.05快淬带优良的性能能够满足MEMS器件的应用。For MEMS chip devices,especially infrared thermal radiation sensors for individual soldiers,parameters such as the absorption behavior,dynamics,and thermodynamics of getter materials are very important for the stability,safety,sensitivity and life of the MEMS chip.Zr0.9Ti0.1V2 was used as the matrix alloy,and the rapid solidification method and rare-earth element Ce alloying method were used to study the effects of different rapid quenching speeds and the addition of Ce element on the microstructure and phase structure of the alloy ribbons.The vacuum packaging process conditions of the MEMS device and the environment of the cavity after the vacuum packaging were simulated.The parameters such as the gettering performance of the Zr0.9-xTi0.1V2Cex(x=0,0.025,0.05,0.075,0.1)ribbons were tested.The results show that higher cooling rate and proper amount of Ce can effectively refine the grains and reduce the formation of the oxide phase Zr3V3O in the Zr0.9-xTi0.1V2Cex ribbons,and improve the oxidation resistance of the getter material during the preparation process.When the content of Ce is 0.05,the alloy ribbons have the best hydrogen absorption performance,which can make the vacuum of the working environment of the simulated MEMS device reach 1×10-3 Pa or more.The addition of Ce makes the platform of the PCT(pressure-component-temperature)curve more flat and broadened,the stability of the dissolved hydrogen is improved,and the hydrogen absorption is increased.The Zr0.85Ti0.1V2Ce0.05 ribbons have large enthalpy change value,strong binding ability with H,and they are easier to absorb hydrogen.According to the Van’t Hoff relationship,the platform at room temperature of 10-14~10-13 Pa is introduced to improve the stability of the device.Zr0.85Ti0.1V2Ce0.05 ribbons with excellent properties can meet the application of MEMS devices.
分 类 号:TG13[一般工业技术—材料科学与工程]
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