提高PCB基板导热等级是必须解决的重要课题  

The important task of improving the thermal conductivity of PCB

作　　者：林金堵 Lin Jindu

机构地区：[1]不详

出　　处：《印制电路信息》2020年第3期6-10,共5页Printed Circuit Information

摘　　要：PCB介质层的"热积累"(温升)已越来越威胁着元器件和基板的电性能和失效率的问题。提高基板介质层耐热性能非常重要,但更重要的是提高导热性能。提高PCB介质层导热系数"等级"是摆在覆铜箔板基材目前的重要而突出的开发、生产课题。The"thermal accumulation"(temperature rise)of PCB dielectric layer has increasingly threatened the electrical performance and failure rate of components.It is important to improve the heat resistance of the substrate,but more importantly to improve the thermal conductivity.To improve the thermal conductivity of PCB is an important and outstanding topic of development and production.

关 键 词：导热等级 耐热性能 导热性能 热设计 

分 类 号：TN41[电子电信—微电子学与固体电子学]