2019年印制电路技术热点  

The hot spots of Printed Circuit Technology in 2019

作　　者：龚永林 Gong Yonglin

机构地区：[1]不详

出　　处：《印制电路信息》2020年第2期1-11,共11页Printed Circuit Information

摘　　要：2019年5G通讯投入商业化,成为PCB技术发展重点。为达到高频特性要求,文章从PCB设计和基材,以及制造技术阐述一些关注点和新发展。对于高端PCB,也应该做到高可靠性。In 2019,5G communication will be commercialized and become the focus of PCB technology development.In order to meet the requirements of high frequency characteristics,this paper describes some concerns and new developments from PCB design,basic materials,and manufacturing technology.For high-end PCB,high reliability should also be achieved.This paper is published in two issues.

关 键 词：印制电路技术 5G要求 设计 基材 制造技术 可靠性 

分 类 号：TN41[电子电信—微电子学与固体电子学]