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作 者:贾园[1] 师瑞峰[2] 蒋勰 刘振[1] JIA Yuan;SHI Ruifeng;JIANG Xie;LIU Zhen(The Key Laboratory for Surface Engineering and Remanufacturing in Shaanxi Province,College of Chemical Engineering, Xi'an University, Xi'an 710065, China;School of Chemistry and Chemical Engineering, Xi'an University of Science and Technology,Xi'an 710054, China)
机构地区:[1]西安文理学院陕西省表面工程与再制造重点实验室,化学工程学院,西安710065 [2]西安科技大学化学与化工学院,西安710054
出 处:《功能材料》2020年第4期4040-4045,4053,共7页Journal of Functional Materials
基 金:陕西省教育厅科研计划资助项目(19JK0741);2019年陕西省大学生创新创业训练资助项目(S201911080056)。
摘 要:环氧树脂材料具有质量轻、造价低、易于规模化生产等特点,兼具较高的强度、耐腐蚀性和绝缘性能,在电子电器材料中得到广泛的应用。在介绍环氧树脂性能的基础上,对其开发情况进行了综述,包括无机共混改性、有机共混改性、化学合成改性等,同时总结了环氧树脂在电子电器材料领域中的应用进展,并展望了其未来的研究方向。Epoxy resin material has the characteristics of light weight,low cost,easy to scale production,high strength,corrosion resistance and insulation properties,thus it has been widely used in electrical and electronic materials.In this paper,the development of epoxy resin was reviewed,including inorganic blending modification,organic blending modification,chemical synthesis modification and so on.The application progress of epoxy resin in the field of electrical and electronic materials was also summarized,and its future research direction was prospected.
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