贴片设备的关键技术及现状  

The Critical Technology of Die Attach Equipment and Application Status

作　　者：程海林 CHENG Hailin(Nayan Technology(Shanghai)Co.,Ltd,Shanghai 201318,China)

机构地区：[1]纳研科技(上海)有限公司,上海201318

出　　处：《电子工业专用设备》2020年第2期7-11,共5页Equipment for Electronic Products Manufacturing

摘　　要：贴片机是芯片封装工艺的重要设备,按照应用类型可分为SMT贴片机和先进封装贴片机,其中后者主要应用于近年来快速发展的引线键合工艺和倒装工艺中。介绍了现有贴片机设备的贴装精度、生产率和市场应用情况,归纳了高精度贴片设备开发过程中的关键技术:视觉对位系统、整机结构设计和精密运动控制,并对比分析各技术的优缺点,为国内相关设备的研究和开发提供参考。Die attach equipment is important to the process of IC chip package.Usually,it can be used in SMT process and advanced package process.In recent years,die attach equipment of advanced package develops rapidly,especially using in wire bond and flip chip process.The article introduces current index of die bonding accuracy,productivity and marketing application,also summarizes the critical technology about vision align system,overall structure design,and precision moving control.Comparing the advantages and disadvantages of those technology.For reference to the related research and development of die attach equipment.

关 键 词：贴片机 邦定机 对准 倒装 

分 类 号：TN605[电子电信—电路与系统]