一种镍基底上连续镀铜层电解退镀剂的开发  

Development of an Electrolytic Stripping Agent for Continuous Copper Plating on Nickel Substrate

作　　者：包志华 郭艳红 田志斌 邓正平 BAO Zhihua;GUO Yanhong;TIAN Zhibin;DENG Zhengping(Guangzhou Sanfu New Materials Technology Co.,Ltd.,Guangzhou 510000,China)

机构地区：[1]广州三孚新材料科技股份有限公司,广东广州510000

出　　处：《电镀与精饰》2020年第4期28-31,共4页Plating & Finishing

摘　　要：研制开发了一种镍基底上连续镀铜层的电解退镀剂,通过正交实验得到最优复配方案为:络合剂A 80 g/L、络合剂B 25 g/L、络合剂C 40 g/L、导电盐60 g/L、缓蚀剂2 g/L、抑雾剂0.2 g/L。此工艺用于镍基底上连续镀铜层的阳极电解退除,退镀速度可达1μm/min,且不腐蚀镍基底,可保持镍层的光亮度。An electrolytic stripping agent for continuous copper plating on nickel substrate was devel oped,the optimal compound scheme was obtained through orthogonal experiment with the complexing agent A concentration of 80 g/L,complexing agent B 25 g/L,complexing agent C 40 g/L,conductive salt 60 g/L,corrosion inhibitor 2 g/L and antifogging agent 0.2 g/L.The stripping agent was used for elec trolytic stripping of copper coating on nickel substrate,the stripping speed could reach 1μm/min.In ad dition,the nickel substrate could avoid corrosion and maintain the brightness.

关 键 词：退镀 连续镀 镍基底退铜 腐蚀 

分 类 号：TG174.4[金属学及工艺—金属表面处理]