并行半导体生产线投料控制策略研究  

Release Control Policy of Parallel Semiconductor Production Lines

作　　者：李莉[1] 于青云 LI Li;YU Qing-yun(Department of Electronics and Information Engineering,Tongji University,Shanghai 201804,China)

机构地区：[1]同济大学电子与信息工程学院,上海201804

出　　处：《控制工程》2020年第3期409-417,共9页Control Engineering of China

基　　金：国家自然科学基金面上项目(51475334)。

摘　　要：首先提出了一种基于主瓶颈设备利用率的并行半导体生产线投料控制策略(Release Control Policy Based on Bottleneck Equipment Utility,RCPBEU):分析投料与主瓶颈设备利用率之间的相关性;通过设定不同的仿真场景,确定主瓶颈设备利用率标准区间值,用于判断每卡待投料工件是否投进该生产线。随后,将瓶颈设备扩展到瓶颈加工区,提出了基于主加工区利用率的并行半导体生产线投料控制策略(Release Control Policy Based on Processing Area Utility,RCPPAU):采用试凑法确定主加工区利用率标准区间值;将主加工区与关系协同投料、主加工区或关系协同投料的方法在仿真系统上进行大量仿真。仿真结果表明,上述方法与固定在制品投料方法相比,出片量、加工周期、准时交货率、紧急工件准时交货率均能得到较大程度的改善。This paper presents a release control policy for parallel semiconductor production line based on bottleneck equipment utility(BEU).The correlation between feeding and bottleneck equipment utilization is analyzed,the standard interval value of bottleneck equipment utilization is determined through setting different simulation scenarios and then determine whether feed each lot into the production line.Take bottleneck processing area into consideration,a release control policy for parallel semiconductor production line based on bottleneck processing area utility(BPAU)is proposed.The standard interval value of bottleneck processing area utilization is determined by trial and error method,and the release control policy is realized based on AND relationship of bottleneck processing area and the corresponding OR relationship.Compared with constant work in process(CONWIP)release control policy,the proposed release control policy can improve the performance by 2.47%,11.58%,19.75%and 17.07%in terms of throughout(TH),cycle time(CT),on-time delivery rate(ODR)and hot lot on-time delivery rate(HLODR).

关 键 词：并行半导体生产线 投料控制策略 主瓶颈设备 主加工区 

分 类 号：TP273[自动化与计算机技术—检测技术与自动化装置]