相转移一步法制备聚酰亚胺模塑粉的工艺及性能表征  

Technology and performance characterization of polyimide molding powder prepared by one step phase transfer method

作　　者：姜海健[1] 苏桂明[1] 方雪[1] 陈明月[1] 崔向红[1] 刘晓东[1] 李天智[1] JIANG Hai-jian;SU Gui-ming;FANG Xue;CHEN Ming-yue;CUI Xiang-hong;LIU Xiao-dong;LI Tian-zhi(Institute of Advanced Technology,Heilongjiang Academy of Sciences,Harbin 150020,China)

机构地区：[1]黑龙江省科学院高技术研究院,黑龙江哈尔滨150020

出　　处：《化学工程师》2020年第4期12-15,共4页Chemical Engineer

摘　　要：使用二苯醚四甲酸二酐(ODPA)和2,4-甲苯二异氰酸酯(TDI-100),通过一步法制备了聚酰亚胺(PI)溶液,经水洗相转移后干燥获得PI模塑粉。用红外光谱法分析确定了产物模塑粉的化学结构,证实所得为聚酰亚胺;用热失重分析仪(TG)和差示扫描量热仪(DSC)测试了PI模塑粉的热学性能;用激光粒度分析表征了PI模塑粉的粒径分布。结果表明,本方法制备的PI模塑粉制备工艺简单,热稳定性好,失重5%的温度为450℃;PI模塑粉玻璃化转变温度(Tg)为266℃;PI模塑粉粒径分布为双峰分布,有利于进行下一步模压成型提高制件的致密度。Polyimide(PI)solution was prepared by one-step method using diphenyl ether tetracarboxylic dianhydride(ODPA)and 2,4-toluene diisocyanate(tdi-100),and then PI molding powder obtained by drying after water washing phase transfer.The chemical structure of the product molding powder was analyzed by infrared spectroscopy,and it was confirmed that the product was polyimide.The thermal properties of PI molding powder were measured by TG and DSC and the particle size distribution of PI molding powder was characterized by laser particle size analysis.The results show that the PI molding powder prepared by this method is simple in preparation process and has good thermal stability,Weight loss 5%at 450℃and the glass transition temperature(Tg)of PI molding powder is 266℃.The particle size distribution of PI molding powder is bimodal,which is conducive to the next step of molding to improve the density of the parts.

关 键 词：聚酰亚胺 水相转移 一步法 双峰分布 

分 类 号：TQ322.3[化学工程—合成树脂塑料工业]