热压烧结制备Cu/FeCoCr复合材料的显微组织及热物理性能  

Microstructure and Thermophysical Properties of Hot-pressed Cu/FeCoCr Composites

作　　者：刘兴军[1,2] 朱家华 何洲峰[1] 张锦彬[1] 杨水源[1] 韩佳甲[1] 卢勇[1] 王翠萍[1] Liu Xingjun;Zhu Jiahua;He Zhoufeng;Zhang Jinbin;Yang Shuiyuan;Han Jiajia;Lu Yong;Wang Cuiping(Fujian Provincial Key Laboratory of Materials Genome,Xiamen University,Xiamen 361005,China;Harbin Institute of Technology,Shenzhen 518055,China)

机构地区：[1]厦门大学福建省材料基因工程重点实验室,福建厦门361005 [2]哈尔滨工业大学,广东深圳518055

出　　处：《稀有金属材料与工程》2020年第2期422-428,共7页Rare Metal Materials and Engineering

基　　金：National Natural Science Foundation of China(51471138)。

摘　　要：利用相图计算的CALPHAD方法和超音雾化制粉技术,在CuFeCoCr体系中设计并制备了一系列微米级复合粉体。通过热压烧结方法在烧结温度为950℃,烧结压力为45 MPa的工艺条件下成功获得块体复合材料。研究了块体复合材料中Cu含量对显微组织,热导率,热膨胀系数以及显微硬度的影响。结果表明:CuFeCoCr块体复合材料均由fcc富铜相和fcc富铁钴铬相组成。该系列复合材料经600℃时效处理8 h后,其热膨胀系数变化范围为5.83×10-6~10.61×10-6 K-1,热导率变化范围为42.17~107.53 W·m-1·K-1。其中Cu55(Fe0.37Cr0.09Co0.54)45复合材料表现出良好的综合性能,即其热膨胀系数和热导率分别为9.08×10-6K-1和91.09 W·m-1·K-1,与电子封装半导体材料的热膨胀系数相匹配。Series of micro-scale powders with composite microstructure based on CuFeCoCr system were successfully designed and fabricated using CALPHAD approach(calculated from phase diagrams) and gas atomization method.The bulk CuFeCoCr composites were produced by hot pressing technique at 950℃ under a pressure of 45 MPa.The effect of Cu content on the microstructure,coefficient of thermal expansion(CTE),thermal conductivity(TC) and micro-hardness(HV) were systematically studied.The results show that the CuFeCoCr composites present a microstructure of two separate fee phases(Cu-rich and FeCrCo-rich phase).After annealing at 500℃ for 8 h,the CTE of the composites ranges from 5.83×10-6~10.61×10-6 K-1 and TC varies from 42.17 W·m-1·K-1 to 107.53 W·m-1·K-1.Particularly,the Cu55(Fe0.37Cr0.09Co0.54)45 composite exhibits excellent comprehensive properties,i.e.CTE of 9.08×10-6 K-1 and TC of 91.09 W·m-1·K-1,which match well with the properties of semiconductors for electronic packaging.

关 键 词：CALPHAD方法 复合材料 液相分离 热膨胀系数 热导率 

分 类 号：TB331[一般工业技术—材料科学与工程]