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作 者:巩云峰 谢兰生[1] 陈明和[1] GONG Yunfeng;XIE Lansheng;CHEN Minghe(College of Mechanical&Electrical Engineering,Nanjing University of Aeronautics and Astronautics,Nanjing 210016,China)
出 处:《机械工程材料》2020年第2期22-26,31,共6页Materials For Mechanical Engineering
摘 要:在不同工艺参数下对化学清洗去除表面氧化膜的6061-T6铝合金进行真空扩散焊接,研究了焊接温度(500~560℃)、焊接压力(1.0~5.0MPa)和保温时间(0.5~3h)对焊接接头界面形貌和剪切强度的影响,得到了优化工艺参数。结果表明:随着焊接温度的升高、焊接压力的增大和保温时间的延长,接头焊缝变窄并最终消失,剪切强度和焊合率增大;但当保温时间延长到3h时,焊缝附近晶粒发生粗化,导致剪切强度降低,且接头发生较大变形;不同工艺参数下接头的剪切断裂形式均为脆性断裂;较优的真空扩散焊接工艺参数为焊接温度540℃、保温时间2h、焊接压力4.0MPa。Vacuum diffusion bonding with different process parameters was conducted on 6061-T6 aluminum alloy after removing surface oxide films by chemical cleaning.Effects of bonding temperatures(500-560℃),bonding pressures(1.0-5.0 MPa)and holding times(0.5-3 h)on the interface morphology and shear strength of the welded joint were studied,and the optimal process parameters were determined.The results show that with the increase of the bonding temperature,bonding pressure and holding time,the weld seam of the joint became narrow and finally disappeared;the shear strength and welding rate were improved.However,when the holding time was extended to 3 h,the grains near the weld seam became coarse,leading to the decrease in the shear strength,and the joint had large deformation.The shear fracture modes of the joints with different process parameters were all brittle fracture.The optimal process parameters for the vacuum diffusion bonding were listed as follows:bonding temperature of 540℃,holding time of 2 h,and bonding pressure of 4.0 MPa.
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