Cu/Ti3SiC2复合材料的制备及微观结构  

Preparation and microstructure of Cu/Ti3SiC2 composites

作　　者：孙小燕[1] 汪江节[2] 张国青[1] 潘培道[1] SUN Xiao-yan;WANG Jiang-jie;ZHANG Guo-qing;PAN Pei-dao(Chizhou University of Mechanical and Electrical Engineering,Chizhou Anhui 247000;Chizhou University of Chemistry and Materials Engineering,Chizhou Anhui 247000,China)

机构地区：[1]池州学院机电工程学院,安徽池州247000 [2]池州学院化学与材料工程学院,安徽池州247000

出　　处：《电子显微学报》2020年第2期112-116,共5页Journal of Chinese Electron Microscopy Society

基　　金：安徽省教育厅高校自然科学研究重点项目(No.KJ2018A0581)。

摘　　要：Ti3SiC2是一种新型的结构陶瓷材料,有诸多优异性能。Cu具有优良的导电和导热性能,耐压性能好且能分流,但有不能抗熔焊缺陷,利用Cu和Ti3SiC2组成复合材料,有望成为新型电接触材料。本文采用Cu粉为基体,Ti3SiC2粉为增强相,采用热压烧结方法制备的Cu/Ti3SiC2复合材料,显微分析观察其组织均匀,团聚少,综合性能较好,在电接触材料中有着巨大的应用前景。通过比较不同烧结温度下制备的样品,发现温度高于750℃,Cu和Ti3SiC2会发生反应,有TiSi2等杂质产生,因此烧结温度为750℃最好。通过对不同体积配比烧结而成的Cu/Ti3SiC2材料性能测试,结果表明:材料的致密度和抗弯强度随着Ti3SiC2含量增加而下降。抗弯断裂后的断口形貌经SEM分析,当Ti3SiC2含量低时,断口呈均匀分布的韧窝;当Ti3SiC2含量增加时,断口呈穿晶断裂形态,使得复合材料弯曲强度较高且呈脆性断裂。Ti3SiC2 is a new structural ceramic material with many excellent properties.Cu has excellent electrical and thermal conductivity,good pressure resistance and shunt resistance,but it cannot resist fusion welding.The composite material composed of Cu and Ti3SiC2 is expected to become a new type of electrical contact material.In this paper,Cu powder is used as the matrix and Ti3SiC2 powder as the reinforcing phase.Cu/Ti3SiC2 composite material is prepared by hot-pressing sintering method.The microstructure of Cu/Ti3SiC2 composite material has uniform structure,less agglomeration and better comprehensive performance.By comparing the samples prepared at different sintering temperatures,it was found that when the temperature is higher than 750℃,Cu and Ti3SiC2 will react,and other impurities TiSi2 would be generated,so the best sintering temperature was 750℃.The Cu/Ti3SiC2 materials sintered with different volume ratios were tested,and the results show that the density and bending strength of the materials decreased with the increase of Ti3SiC2 content.SEM analysis of fracture morphology after flexural fracture shows that,when Ti3SiC2 content is low,the fracture shows uniform distribution of dimples,and when Ti3SiC2 content increases,it presents a typical transgranular fracture form,resulting in higher bending strength and brittle fracture of composite materials.

关 键 词：Cu/Ti3SiC2 烧结温度 制备 显微组织 

分 类 号：TB333[一般工业技术—材料科学与工程] TG115.215.3[金属学及工艺—物理冶金]