硅酸三钙硬化浆体三维空间结构的连续切片成像研究  

Serial block-face imaging of the three-dimensional structure of hardened C3S paste

作　　者：杨飞 刘贤萍[1,2] 赵永娟 王培铭[1,2] 陈波[1,3] YANG Fei;LIU Xian-ping;ZHAO Yong-juan;WANG Pei-ming;CHEN Bo(School of Materials Science and Engineering,Tongji University,Shanghai 201804;Key Laboratory of Advanced Civil Engineering Materials,Ministry of Education(Tongji University),Shanghai 201804;Key Laboratory of Performance Evolution and Control for Engineering Structures,Ministry of Education(Tongji University),Shanghai 200092,China)

机构地区：[1]同济大学材料科学与工程学院,上海201804 [2]先进土木工程材料教育部重点实验室(同济大学),上海201804 [3]工程结构性能演化与控制教育部重点实验室(同济大学),上海200092

出　　处：《电子显微学报》2020年第2期128-133,共6页Journal of Chinese Electron Microscopy Society

基　　金：同济大学高端人才计划-材料纳米结构表征(Nos.152221,152243)。

摘　　要：本文通过连续切片扫描电子显微镜(SBFSEM)对水灰比0.6、20℃恒温密闭养护7 d的硅酸三钙硬化浆体进行研究,并通过三维图像处理软件Avizo对获取的200张背散射电子(BSE)图像进行分析。结果表明,通过SBFSEM在高真空以及1 kV电压下获取的连续BSE图像经过Avizo分析处理后,获得的最小孔体积和最小未水化颗粒体积分别为3.6×10^4 nm^3和3.7×10^4 nm^3;93%的未水化硅酸三钙的体积介于3.6×10^4 nm^3和1.0×10^7 nm^3之间,88.9%的孔的体积介于3.7×10^4 nm^3和3.2×10^6 nm^3之间;三维重构所得的总孔体积占硬化浆体总体积的4.5%。Serial block-face scanning electron microscopy(SBFSEM)was used to study the hardened tricalcium silicate(C3S)paste with water-cement ratio of 0.6.The samples were cured at 20℃and tested at the age of 7 days.Three-dimensional(3 D)analysis of the acquired 200 images from backscattered electron(BSE)was performed by ImageJ and Avizo software.The results show that the un-hydrated C3S grains and pores of the epoxy embedded sample are irregular in 3 D space.The minimum volume of the pores and un-hydrated grains obtained by SBFSEM measurement at the high vacuum and with accelerating voltage of 1 kV are 3.6×10^4 nm^3 and 3.7×10^4 nm^3,respectively.The volumes of 93%of the un-hydrated C3S grains are between 3.6×10^4 nm^3 and 1.0×107 nm3,accounts for 67.6%of the total volume of the un-hydrated C3S grains.The volumes of 88.9%of the pores are between 3.7×10^4 nm^3 and 3.2×106 nm3,and the total volume of the pores accounts for 4.5%of the total volume of the hardened C3S paste.

关 键 词：连续切片扫描电子显微镜(SBFSEM) 硅酸三钙硬化浆体 三维重构 孔体积 

分 类 号：TG115.215.3[金属学及工艺—物理冶金] TQ172.71[金属学及工艺—金属学]