代六价铬电镀现状及趋势  被引量:5

Current status and development trends of alternative processes to hexavalent chromium electroplating

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作  者:邓正平 田志斌 詹益腾 郭艳红 DENG Zhengping;TIAN Zhibin;ZHAN Yiteng;GUO Yanhong(Guangzhou Sanfu New Materials Technology Co.,Ltd.,Guangzhou 510663,China)

机构地区:[1]广州三孚新材料科技股份有限公司,广东广州510663

出  处:《电镀与涂饰》2020年第7期440-443,共4页Electroplating & Finishing

摘  要:简述了六价铬电镀的危害。综述了目前研究和应用广泛的代铬电镀技术,如三价铬电镀技术,锡基、镍基合金电镀技术,以及复合电镀技术,阐述了它们的特点及应用。指出了目前代铬电镀技术存在的问题,提出了今后的发展趋势。The hazards of hexavalent chromium electroplating were described.Some alternative electroplating processes widely studied and used at present were summarized,such as trivalent chromium electroplating,tin-and nickel-based alloy electroplating,and composite electroplating.Their characteristics and applications were introduced.The problems of the current alternatives to hexavalent chromium electroplating were pointed out.The development trends in this field were proposed.

关 键 词:六价铬电镀 替代 三价铬 锡基合金 镍基合金 复合镀层 综述 

分 类 号:TQ153.11[化学工程—电化学工业] TQ153.2

 

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