电子倍增CCD相机制冷绝热设计  

Refrigeration and thermal insulation design of EMCCD camera

作　　者：沈远航 马文礼[1] 陈科位 Shen Yuanhang;Ma Wenli;Chen Kewei(Institute of Optics and Electronics,Chinese Academy of Science,Chengdu 610209,China;University of Chinese Academy of Sciences,Beijing 100049,China)

机构地区：[1]中国科学院光电技术研究所,成都610209 [2]中国科学院大学,北京100049

出　　处：《低温工程》2020年第2期57-63,共7页Cryogenics

基　　金：中国科学院西部之光项目(YA18K005)。

摘　　要：对电子倍增CCD(EMCCD)相机制冷的必要性以及热电制冷器(TEC)的特点进行了说明,阐述了真空绝热的优势,分析了真空绝热失效条件,提出了真空绝热的难点及真空保持方案,分析了相机芯片发挥其性能所需的制冷温度,对制冷相机漏热途径进行了分析,计算了克服漏热所需的制冷功率,并设计了制冷绝热方案,对相机进行了稳态热分析建模,将多级热电制冷器进行了参数化转化并将其带入模型边界中,经过迭代拟合得到了相机杜瓦及芯片温度分布,分析了绝热制冷方案的可行性。The importance of electron multiplying CCD(EMCCD)camera cooling and the characteristics of TEC were explained.The advantages of vacuum insulation were expounded and the vacuum insulation failure conditions were analyzed.The difficulty of vacuum insulation and the vacuum maintenance scheme were proposed.The cooling temperature required for the chip to exert its capability and the heat leakage path of the camera were analyzed.The cooling power required to overcome the leakage heat is calculated.The refrigeration and insulation scheme of the camera is designed.The steady state thermal analysis model of the camera was carried out.The parametric transformation of the multi-stage TEC was brought into the model boundary.Dewar and chip temperature distributions were obtained through iterative fitting.The feasibility of the refrigeration and insulation scheme was analyzed.

关 键 词：电子倍增CCD(EMCCD)相机 制冷技术 热电制冷器 绝热设计 热分析 

分 类 号：TB611[一般工业技术—制冷工程]