JTAG测试技术在模块级测试中的应用  

Application of JTAG Test Technology in Module Level Test

作　　者：王滨 Wang Bin(AVIC Xi'an Aeronautics Computing Technique Research Institute,Xi'an Shaanxi,710065)

机构地区：[1]中国航工业集团公司西安航空计算技术研究所,陕西西安710065

出　　处：《电子测试》2020年第9期112-113,63,共3页Electronic Test

摘　　要：目前,随着板级器件密度的不断增大,尤其是表贴器件、BGA器件的大量使用,传统的测试方法,如使用万用表、示波器等已不能够覆盖足够的测试面积,这为模块测试带来了挑战。而随着支持IEEE1149.1标准的器件在模块中广泛的应用,很好的解决了这一问题。文章从JTAG边界扫描技术的原理出发,探讨如何将该技术应用到模块级测试中,为模块测试诊断带来便利。At present,with the increasing component’s density of module level,in particular,these modules contains a large number of surface mount components and BGA components.The traditional test methods such as using multi-meter and oscilloscope,can’t cover enough test area,which brings a challenge to test module.With the wide application of components support IEEE1149.1 standard in the module,this problem is well solved.Starting from the principle of JTAG boundary scan technology,this paper discusses how to apply this technology to test module,which will bring convenience for module test diagnosis.

关 键 词：模块级 JTAG边界扫描技术 测试诊断 

分 类 号：TN407[电子电信—微电子学与固体电子学]