提高温度变换器抗冲击能力的研究与应用  

Research and Application of Improving Impact Resistance of Temperature Transmitter

作　　者：刘辉 田金野 施安琪 唐秀萍 Liu Hui;Tian Jinye;Shi Anqi;Tang Xiuping(Beijing Research Institute of Telemetry,Beijing 100076)

机构地区：[1]北京遥测技术研究所,北京100076

出　　处：《航天制造技术》2020年第2期21-24,共4页Aerospace Manufacturing Technology

摘　　要：新型运载火箭对电子设备提出了更高抗冲击能力的要求。运用ANSYS Workbench软件分析冲击试验中出现问题的温度变换器,知悉了印制电路板的形变分布,分析出产品存在的防冲击工艺措施不足、印制电路板厚度不够、元器件布局不合理等抗冲击的薄弱环节,并给出了解决措施。解决了温度变换器大冲击试验条件下抗力学性能差的问题,提升了产品的可靠性,保证了产品的质量,并将该技术应用于后续的型号中。The new launch vehicle puts forward the requirement of higher impact resistance to electronic equipment.In this paper,the stress analysis under the impact experiment of the problematic temperature transmitter was carried out by using ANSYS Workbench software,and the distribution of deformation of the printed circuit board was known.The weak link of anti-impact process measures,insufficient thickness of the printed circuit board and unreasonable layout of components was analyzed,and the solution measures were given.The problem of poor resistance to mechanical properties under the condition of the large impact test of the temperature transmitter was solved,the reliability of product was guaranteed,and the technology was applied to the subsequent models.

关 键 词：温度变换器 冲击响应谱试验 应力分析 粘固 

分 类 号：V475.1[航空宇航科学与技术—飞行器设计]