低介电耐高温苯并环丁烯有机硅树脂的合成与性能  

Synthesis and Properties of Low Dielectric and High Thermostability Benzocyclobutene Silicone Resin

作　　者：赵维维 苏韬 周凯运 轩立新[1] Zhao Weiwei;Su Tao;Zhou Kaiyun;Xuan Lixin(China Aviation Industry Corporation Jinan Special Structure Research Institute Composite Materials Research Office,Shandong Jinan 250023)

机构地区：[1]中国航空工业集团公司济南特种结构研究所复合材料研究室,山东济南250023

出　　处：《云南化工》2020年第4期93-96,共4页Yunnan Chemical Technology

摘　　要：从分子结构入手设计了一种低介电耐高温苯并环丁烯有机硅树脂分子结构,并针对设计的分子结构进行了表征。合成的树脂热分解温度为443.6℃,玻璃环转变温度≥350℃,具有较高的热稳定性,可用作耐高温树脂基体;同时苯并环丁烯有机硅树脂在较宽的频率范围内(2~20 GHz)具有稳定的介电常数(≤2.65)和损耗角正切(≤0.007),这使其具有良好的透波性能,在透波领域有着潜在的应用前景。In this paper, a kind of benzocyclobutene silicone resin was designed and synthesized successfully. The benzocyclobutene silicone resin showed high thermal decomposition temperature at 443.6℃and the glass-transition temperature(Tg) higher than 350℃,which make it can be used as high performance thermosets matrix. At the same time, the cured resins exhibited relative stable dielectric contants(≤2.65) and loss tangents (≤0.007) in the frequency from 2 GHz to 20 GHz, which exhibited an excellent wave transmissivity and the potential application in wave transmissivity fields.

关 键 词：苯并环丁烯 有机硅 介电常数 透波 

分 类 号：TQ324.8[化学工程—合成树脂塑料工业] TM215.1[一般工业技术—材料科学与工程]