结构/屏蔽一体化复合材料研究现状及发展趋势  

Research and Development of Structural/Shielding Integrated Composites

作　　者：王东红[1,2] 张泽奎 张晗[1,2] 管立斌 Wang Donghong;Zhang Zekui;Zhang Han

机构地区：[1]中国电子科技集团公司第三十三研究所 [2]电磁防护材料及技术山西省重点实验室

出　　处：《安全与电磁兼容》2020年第2期85-89,共5页Safety & EMC

基　　金：装备发展部领域基金项目(61409220411)。

摘　　要：面对电子设备和系统的综合性迫切需求,现有电磁屏蔽材料在屏蔽效能、带宽、密度、强度以及极端环境适应性等方面各有优缺点,结构/屏蔽一体化复合材料已成为近几年电磁防护材料技术领域的研究重点和热点。重点介绍了国内外在结构/屏蔽一体化复合材料方面的研究情况,并对铝镁合金、树脂基电磁屏蔽复合材料等典型结构/屏蔽一体化复合材料的发展趋势进行展望。Faced with the urgent need of electronic equipment and system,the existing electromagnetic shielding materials have their own advantages and disadvantages in shielding effectiveness,bandwidth,density,strength and extreme environmental adaptability.Structural/shielding integrated composite materials have become the research focus and hot spot in the field of electromagnetic protection materials technology in recent years.In this paper,the research status of structural/shielding integrated composites at home and abroad is introduced,and it is also prospected the development trend of typical structural/shielding integrated composites,such as Al-Mg alloy,resin-based electromagnetic shielding composites.

关 键 词：电磁屏蔽 铝合金 镁合金 树脂基复合材料 结构/屏蔽一体化复合材料 

分 类 号：TB33[一般工业技术—材料科学与工程]