基于PDMS-PMMA材料的微流控芯片等离子体键合工艺研究  

Research on Plasma Bonding Technology of Microfluidic Chip Based on PDMS-PMMA Material

作　　者：宋春辉 胡志刚[1,2] 杜喆 祖向阳[1] 宋克纳 SONG Chun-hui;HU Zhi-gang;DU Zhe;ZU Xiang-yang;SONG Ke-na(School of Medical Technology and Engineering,Henan University of Science and Technology,Luoyang 471003,China;Intelligent Rehabilitation Medical Robot Engineering Research Center In Henan,Luoyang 471003,China)

机构地区：[1]河南科技大学医学技术与工程学院,河南洛阳471003 [2]河南省智能康复医疗机器人工程研究中心,河南洛阳471003

出　　处：《塑料工业》2020年第4期166-171,152,共7页China Plastics Industry

基　　金：国家科技部专项(2017ZX04011017-010);河南省中韩国际合作项目(182102410046)。

摘　　要：为了提高聚二甲基硅氧烷(PDMS)盖片和聚甲基丙烯酸甲酯(PMMA)基片的复合式微流控芯片键合的稳定性,开展了微流控芯片等离子处理特性的时间因素的研究。利用红外光谱和扫描电镜对处理前后的PMMA进行表征,确定硅烷化等离子方法的可行性;同时对PDMS、PMMA和硅烷化PMMA不同等离子处理时间的接触角及接触角恢复情况进行测量,采用正交试验法得到了最大键合力所需的最佳等离子处理时间以及有效操作时域,研究结果为确定微流控芯片的等离子体键合工艺参数提供借鉴。In order to improve the stability of the bonding of the composite microfluidic chip of the polydimethylsiloxane(PDMS)cover sheet and the polymethyl methacrylate(PMMA)substrate,the time factor of the plasma processing characteristics of the microfluidic chip was studied.The PMMA before and after treatment was characterized by infrared spectroscopy and scanning electron microscopy to determine the feasibility of silanized plasma method.At the same time,the contact angles and contact angle recovery of PDMS,PMMA,and silylated PMMA with different plasma treatment time were measured,the orthogonal plasma test method was used to obtain the optimal plasma treatment time and effective operation time domain required for the maximum bonding force.The research results provide a reference for determining the plasma bonding process parameters of the microfluidic chip.

关 键 词：聚二甲基硅氧烷 聚甲基丙烯酸甲酯 键合 接触角 处理时间 

分 类 号：TQ316[化学工程—高聚物工业]