扫描电镜研究陶瓷-金属结合界面的样品制备方法  

Study on ceramic-metal bonding cross-section sample preparation method by SEM

作　　者：尚俊玲[1] 詹美燕[1] 李春明[1] Shang Junling;Zhan Meiyan;Li Chunming(Experimental Center,School of Materials Science and Technology,South China University of Technology,Guangzhou 510641,China)

机构地区：[1]华南理工大学材料学院实验中心,广州510641

出　　处：《分析仪器》2020年第2期86-89,共4页Analytical Instrumentation

摘　　要：采用机械抛光和直接断裂的方法制备了研究陶瓷-金属的界面结合的断面样品,扫描电镜观察结果表明,直接断裂样品的陶瓷与金属界面清晰。在20kV高压下的背散射图像和能谱面扫描,很好地表征了陶瓷间金属层的成分变化。Ceramic-metal bonding cross-section samples were prepared by using mechanical-polishing method and fracturing method,and observed by scanning electron microscopy.The results showed that the interface between ceramic and metal was clearer in the fracturing sample.Composition of metal layer in ceramics was revealed very well by backscatter image under 20 kV high pressure and energy dispersive spectrometer(EDS)mapping.

关 键 词：断面 扫描电子显微镜 陶瓷-金属 界面结合 方法 

分 类 号：TG115[金属学及工艺—物理冶金] TQ174.1[金属学及工艺—金属学]