微乳法制备参数对纳米锡银铜焊粉熔点的影响  

Synthesis of Nano-SnAgCu Solder by Microemulsion Method

作　　者：俞鑫 邸彤彤 沈杭燕[1] YU Xin;DI Tongtong;SHEN Hangyan(School of Material and Chemistry,China Jiliang University,Hangzhou 310018,China)

机构地区：[1]中国计量大学材料与化学学院,杭州310018

出　　处：《材料研究学报》2020年第4期299-303,共5页Chinese Journal of Materials Research

基　　金：浙江省科技计划(2018C01123)。

摘　　要：用微乳法制备低熔点纳米锡银铜焊粉并揭示其机理,研究了表面活性剂、锡前驱体和微乳液比例对合成的纳米SAC粒子熔点的影响。在最优工艺参数条件下合成的纳米Sn3.0Ag0.5Cu其熔化起始温度为183.6℃,比市售焊锡膏(217.8℃)降低了32.2℃,与传统Sn-Pb焊料的最低熔点183℃接近。Nano-SnAgCu solder of low melting point was prepared by means of microemulsion method. The effect of different surfactants, Sn-precursors and the ratio of microemulsion on the melting temperature of the prepared particles of nano-SnAgCu solder was systematically investigated. Results show that the lowest initial melting temparture, 183.6 oC was acquired for the particles of nano-SnAgCu solder prepared via the process with optimal processing parameters, namely the prepared Sn3.0 Ag0.5 Cu solder presents a melting point of 183.6 oC, which is close to 183 oC of the lowest melting point of SnPb solder,while is c.a. 32.2 oC below that of the commercial solder paste(217.8 oC).

关 键 词：有色金属及其合金 纳米SnAgCu焊粉 微乳液法 熔点 

分 类 号：TG425[金属学及工艺—焊接]