基于双金属片和金属板的无热AWG温度补偿研究  

Study of athermal AWG temperature compensation based on the bimetallic strip and the metal plate

作　　者：李朝锋[1] 冯杰 LI Chaofeng;FENG Jie(The 34th Research Institute of CETC,Guilin Guangxi 541004,China;Military Representative Office of Military Representative Bureau in Guilin Central Military Commission Equipment Development Department)

机构地区：[1]中国电子科技集团公司第三十四研究所,广西桂林541004 [2]中央军委装备发展部军事代表局驻桂林地区军事代表室

出　　处：《光通信技术》2020年第5期38-41,共4页Optical Communication Technology

摘　　要：为解决无热模块的小型化封装问题,针对现有的2种无热补偿方案的研究提出了一种新型的基于双金属片和金属板双重补偿的阵列波导光栅(AWG)温度补偿结构。理论计算结果表明:该结构能够实现波长漂移的温度补偿,并使金属板的长度缩小为位移无热补偿型的14,实现模块小型化封装,通过调整双金属片的厚度、宽度以及金属板的长度来适应AWG芯片的波长漂移量,提高了设计的灵活性。According to the study of two existing athermal compensation schemes,a new athermal arrayed waveguide gratings(AWG)temperature compensation structure has been presented to solve the problem of miniaturized packaging of athermal module in this paper,which is based on the bimetallic strip and the metal plate.The theoretical calculation results show that linear wavelength shift can be completely compensated.In addition,the length of the metal plate was reduced to 1/4 of the original one,enabling the module to be miniaturized.This structure can adapt to the wavelength shift of the AWG chip by adjusting the thickness,width of the bimetal,and the length of the metal plate,which improves the design flexibility.

关 键 词：阵列波导光栅 温度补偿 双金属片 金属板 无热化 

分 类 号：TN914[电子电信—通信与信息系统]