集成电路技术领域最新进展及新技术展望  

The Latest Development and Trend of IC Technology

作　　者：朱进宇 闫峥[1] 苑乔[1] 张少真 ZHU Jinyu;YAN Zheng;YUAN Qiao;ZHANG Shaozhen(SpaceStar Technology Co.,Ltd.,Beijing 100096,P.R.China;Institute of Microelectronics,Tsinghua University,Beijing 100084,P.R.China)

机构地区：[1]航天恒星科技有限公司(503所),北京100096 [2]清华大学微电子研究所,北京100084

出　　处：《微电子学》2020年第2期219-226,共8页Microelectronics

摘　　要：目前,最先进的CMOS工艺逐渐逼近单原子尺度,单纯靠工艺进步来推动发展的时代即将结束,集成电路发展将进入"后摩尔时代"。在"后摩尔时代",集成电路的发展不会随着"摩尔定律"失效而终结,相反,以应用为导向的需求将使集成电路呈现出更加旺盛的发展活力。在边缘计算、人工智能、5G/物联网等应用需求快速兴起的背景下,从集成电路涉及的材料、器件、工艺、设计、封装、新理论及方法学等方面,详细介绍了"后摩尔时代"集成电路最新进展,分析其发展趋势。最后,简要介绍了未来可能对集成电路当前技术路线产生颠覆性影响的二维器件、量子计算等前沿领域的进展,并进行了展望。The latest CMOS process is gradually approaching the single atomic scale that means the era of Moore’s law is coming to an end, and the development of IC has entered the "More than Moore era". In the "More than Moore era", IC will not end with the failure of "Moore’s law", and IC technology driven by application-oriented demand will present more vigorous vitality. Based on the background of the rapid rise of edge computing, AI, 5 G/IoT, etc., the latest IC technology was introduced in detail, and its development trend from the aspects of materials, devices, process, design, packaging, new theory and integrated innovation was analyzed. Finally, a brief introduction and prospect of some frontier fields such as two-dimensional devices and quantum computing that may have a disruptive impact on IC technology in the future was given.

关 键 词：集成电路 摩尔定律 后摩尔时代 二维器件 量子计算 

分 类 号：TN432[电子电信—微电子学与固体电子学] TN47