钢基体参数对钢/铜双金属结合界面的影响  

Effect of Steel Substrate Parameters on Bonding Interface of Steel/Copper Bimetal

作　　者：邢明 张国伟[1] 王明杰[1] 康圆圆 XING Ming;ZHANG Guowei;WANG Mingjie;KANG Yuanyuan(School of Material Science and Engineering,North University of China,Taiyuan 030051,China)

机构地区：[1]中北大学材料科学与工程学院,山西太原030051

出　　处：《热加工工艺》2020年第8期77-79,83,共4页Hot Working Technology

摘　　要：对高铅锡青铜ZCuPb20Sn5浇注钢基体进行试验研究,采用正交试验法分别研究钢基体材料、钢基体预热时间和钢基体预热温度对钢/铜双金属结合界面的影响。试验结果表明:钢基体为45钢、预热温度为1200℃、预热时间为2.5 h时,钢/铜双金属界面结合达到最佳效果,此时钢/铜双金属界面结合强度达到133 MPa,Cu原子和Fe原子之间的扩散距离达到14μm。The experimental research that high-lead bronze ZCuPb20Sn5 poured the steel matrix was carried out,the effect of the steel substrate material,the steel substrate preheating time and the steel substrate preheating temperature on the bonding interface of steel/copper bimetal was studied by using the orthogonal test method,respectively.The experimental results show that,the interface bonding of steel/copper bimetal reaches the best,and the interface bonding strength of steel/copper bimetal reaches 133 MPa,the atoms of Cu and Fe diffusion distance reaches 14μm,when the steel substrate is 45 steel,the preheating temperature is 1200℃,and the preheating time is 2.5 h.

关 键 词：ZCuPb20Sn5 钢基体材料 预热时间 预热温度 结合强度 

分 类 号：TB331[一般工业技术—材料科学与工程]