MeO掺杂Ag/SnO2电接触材料的结构与性能  

Microstructure and Properties of MeO Doped Ag/SnO2 Electric Contact Materials

作　　者：杨芳儿 王贵葱 穆成法 吴君臣 沈涛 张玲洁 郑晓华[2] Yang Fanger;Wang Guicong;Mu Chengfa;Wu Junchen;Shen Tao;Zhang Lingjie;Zheng Xiaohua(Zhejiang University of Technology,Hangzhou 310014,China;Wenzhou Hongfeng Electrical Alloy Co.Ltd,Wenzhou 325603,China;Zhejiang-California International Nanosystems Institute,Zhejiang University,Hangzhou 310058,China;Department of Materials Science and Engineering,Zhejiang University,Hangzhou 310027,China)

机构地区：[1]浙江工业大学材料科学与工程学院,浙江杭州310014 [2]浙江工业大学,浙江杭州310014 [3]温州宏丰电工合金股份有限公司,浙江温州325603 [4]浙江大学浙江加州国际纳米技术研究院,浙江杭州310058 [5]浙江大学材料科学与工程学院,浙江杭州310027

出　　处：《稀有金属材料与工程》2020年第4期1301-1305,共5页Rare Metal Materials and Engineering

基　　金：浙江省重点研发计划项目(2017C01051);浙江省自然科学基金(LQ17E010002)。

摘　　要：采用机械合金化技术将不同用量的CuO或Fe2O3粉掺入银和SnO2粉中制备Ag/SnO2(x)-MeO(y)复合粉体,并辅以热压成型工艺制得Ag/SnO2(x)-MeO(y)电接触材料。采用扫描电镜、X射线衍射仪、电阻测试仪、硬度计及拉伸试验机等测试仪器对材料的组织结构、物理和力学性能进行了表征。结果表明:随着掺杂剂用量的增加,Ag/SnO2(x)-MeO(y)材料的密度逐渐降低,且CuO较Fe2O3更利于提高材料的导电性。2种掺杂剂均能显著改善Ag/SnO2(x)-MeO(y)材料的塑性变形能力。Ag/SnO2(11.2%)-CuO(0.8%)(也即CuO用量为0.8%)材料的电阻率达到最低值2.35μΩ·cm,延伸率约为9.1%,比Ag/SnO2材料的延伸率提高近93.6%,综合性能最优。Ag/SnO2(x)-MeO(y)composite powders were obtained by mechanical alloying different amounts of CuO or Fe2O3 powders with Ag and SnO2 powders,and Ag/SnO2(x)-MeO(y)electrical contact materials were prepared by hot pressing process.The microstructure and physical and mechanical properties of the materials were characterized by scanning electron microscopy,X-ray diffractometry,resistance tester,hardness tester and tensile tester.The results show that the density of Ag/SnO2(x)-MeO(y)materials decreases with the increase of dopant content,and CuO is more conducive to improve the conductivity of Ag/SnO2(x)-MeO(y)material than Fe2O3.The two dopants can obviously improve the capacity of plastic deformation of Ag/SnO2(x)-MeO(y)material.The Ag/SnO2(11.2%)-CuO(0.8%)material(i.e.CuO content=0.8%)exhibits the best comprehensive properties with the resistivity of 2.35μΩ·cm,elongation of 9.1%(higher than that of Ag/SnO2 material by 93.6%).

关 键 词：AG/SNO2 电接触材料 掺杂剂 电阻率 延伸率 

分 类 号：TM201.4[一般工业技术—材料科学与工程]