铜板带热镀锡工艺研究  

Study on Hot Dip Tinning Process of Copper Strip

作　　者：刘玉亮[1,2] 田保红 何鹏宇[1] 杨阳 殷婷 王胜刚 LIU Yuliang;TIAN Baohong;HE Pengyu;YANG Yang;YIN Ting;WANG Shenggang(School of Materials Science and Engineering,He'nan University of Science and Technology,Luoyang 471023,China;Collaborative Innovation Center of Nonferrous Metals He'nan Province,Luoyang 471023,China;Institute of Metal Research,Chinese Academy of Sciences,Shenyang 110016,China)

机构地区：[1]河南科技大学材料科学与工程学院,河南洛阳471023 [2]有色金属共性技术河南省协同创新中心,河南洛阳471023 [3]中国科学院金属研究所,辽宁沈阳110016

出　　处：《热加工工艺》2020年第6期103-105,共3页Hot Working Technology

基　　金：河南省科技开放合作项目(172106000058)。

摘　　要：通过调控T2紫铜板带热镀锡工艺中的镀锡温度与镀锡时间,得到不同厚度的铜锡化合物层(Cu6Sn5),并利用扫描电子显微镜确定Cu6Sn5层的厚度,研究了当镀锡时间和温度中一个变量发生改变时Cu6Sn5层厚度的变化规律。结果表明:当热浸镀锡时间一定时,Cu6Sn5层的厚度随着温度的增加而增加;当镀锡的温度低于某个温度时,Cu6Sn5层的厚度与热浸镀锡时间的关系不大;当热浸镀锡温度为280℃、镀锡时间为4~6 s时,Cu6Sn5层的平均厚度为4.25μm,最接近国外生产的铜板带热浸镀锡产品的Cu6Sn5层厚度。The copper-tin compound layer(Cu6Sn5)with different thickness was obtained by adjusting the tin plating temperature and the tin plating time in the hot tin plating process of T2 pure copper strip.The thickness of Cu6Sn5 layer was determined by scanning electron microscope(SEM),and the thickness variation of Cu6Sn5 layer was studied when a variable in tin plating time and temperature changed.The results show that,the thickness of Cu6Sn5 layer increases with the increase of temperature when the hot-dip tin plating time is constant.When the temperature of tin plating is lower than a certain temperature,the thickness of Cu6Sn5 layer is not related to the time of hot dip tin plating.When the hot-dip tin plating temperature is 280℃ and the tin plating time is 4-6 s,the average thickness of the Cu6Sn5 layer is 4.25μm,which is the closest to the Cu6Sn5 layer thickness of the copper strip hot-dip tin plating product produced abroad.

关 键 词：热镀锡 镀锡温度 镀锡时间 Cu6Sn5 

分 类 号：TG174.44[金属学及工艺—金属表面处理]