某弹载电子机箱的热设计  

Thermal Design of the Missile Borne Cabinet

作　　者：张新东 金旸霖 韩文静 ZHANG Xindong;JIN Yanglin;HAN Wenjing(Shanghai Aerospace Science and Industry Electric Appliance Research Institute Co.,Ltd.,Shanghai 200331,China)

机构地区：[1]上海航天科工电器研究院有限公司,上海200331

出　　处：《机械与电子》2020年第5期47-50,共4页Machinery & Electronics

摘　　要：针对弹载电子机箱在恶劣环境下的散热问题,开展了密闭式机箱的热设计工作。基于理论与仿真相结合的分析方式,首先合理优化机箱表面翅片参数,增加散热面积;其次改善电子机箱壳体框架,减小壳体间接触热阻;最后引入均温板的模块壳体,提高内部传热效率;通过与储热板的模块壳体对比分析,探索新的弹载电子机箱热设计,来满足弹载环境温升要求,保证内部电路正常工作。To solve the heat dissipation of the missile borne cabinet in the harsh environment,the thermal design of closed cabinet was carried out.Based on the analysis of theory and simulation,firstly the surface of the chassis was optimized rationally by changing the parameters of fins,to increase the area of heat dissipation;secondly the ameliorative frame of the electronic chassis helps to reduce the thermal resistance between the shells;Moreover,the use of uniform temperature board helps to improve internal efficiency of the heat transfer;Finally,through the comparative analysis of the thermal storage plate and uniform temperature board,the new thermal design of the missile borne cabinet was explored,in order to meet the requirements of the missile borne cabinet and ensure normal operation of the internal circuit.

关 键 词：弹载电子机箱 子卡模块 热设计 Icepak 

分 类 号：TK124[动力工程及工程热物理—工程热物理]