新型超宽多排集成电路封装模具设计要领  

Design Essentials of New Ultra-W ide&M ulti-Row IC Packaging Mold

作　　者：曹玉堂 汪宗宝 汪宗华 姚亮 赵松 徐善林 宫林 汪山 Cao Vutang;Wang Zongbao;Wang Zonghua;Yao Liang;Zhao Song;Xushanlin;Gong Lin;Wang Shan

机构地区：[1]铜陵文一三佳科技股份有限公司技术部,安徽铜陵244000

出　　处：《模具制造》2020年第5期50-52,共3页Die & Mould Manufacture

摘　　要：介绍了新型超宽多排集成电路封装模具基本结构、工作过程,指出新型超宽多排集成电路封装模具设计时注意事项,型腔充填、流道平衡、注射压力等核心零部件设计要点。同时系统地介绍了电子塑料封装模具各部件功能、作用、设计原则,为行业内人士了解新型超宽多排集成电路封装模具技术要领提供了依据、有益参考,对新型超宽多排集成电路封装模具设计人员具有一定的指导意义。This paper introduces the basic structure and working principle of the new ultra-wide multi-row IC packaging mold,and points out the key design points of the new ultra-wide multi-row IC packaging mold,such as cavity filling,runner balance,injection pressure,etc.At the same time,the functions,functions and design principles of various components of the electronic plastic packaging mold are systematically introduced,which provides a basis and beneficial reference for the industry to understand the technical essentials of the new ultra-wide multi-row integrated circuit packaging mold and has certain guiding significance for the designers of the new ultra-wide multi-row integrated circuit packaging mold.

关 键 词：封装模具 热胀匹配 同步注射 流道平衡 模架部件 

分 类 号：TQ320.66[化学工程—合成树脂塑料工业]