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作 者:贾园[1] 师瑞峰[2] 呼雪 杨菊香[1] Jia Yuan;Shi Ruifeng;Hu Xue;Yang Juxiang(The Key Laboratory for Surface Engineering and Remanufacturing in Shaanxi Province,College of Chemical Engineering,Xi’an University,Xi’an 710065,China;School of Chemistry and Chemical Engineering,Xi’an University of Science and Technology,Xi’an 710054,China)
机构地区:[1]西安文理学院化学工程学院,陕西省表面工程与再制造重点实验室,西安710065 [2]西安科技大学化学与化工学院,西安710054
出 处:《工程塑料应用》2020年第4期139-143,149,共6页Engineering Plastics Application
基 金:陕西省教育厅科研计划项目(19JK0741);国家级大学生创新创业项目(201711080002);西安市科技局计划项目文理专项(2019KJWL01)。
摘 要:在介绍传统环氧树脂性能的基础上,对导热环氧树脂复合材料当前的研究进展进行了综述,重点论述了在不降低环氧树脂原有性能的前提下对其导热性能进行优化的方法,主要包括填充型和本征型导热环氧树脂复合材料的研究;总结了导热环氧树脂复合材料常见的三种导热机理:导热通路理论、声子传热理论和逾渗理论,并探讨了导热型环氧树脂复合材料的结构及导热填料的分散构筑状态对其导热性能的影响机制;最后展望了其在未来微电子材料及航天航空领域中的应用研究发展方向。On the basis of introducing the properties of traditional epoxy resin,the current research progress of heat-conducting epoxy resin composite was reviewed,the methods to optimize the thermal conductivity of epoxy resin without reducing their original performance was emphasized,mainly including the research of filled and intrinsic heat-conducting epoxy resin composite.The most common thermal conduction mechanisms of heat-conducting epoxy resin composite were summarized:thermal conduction path theory,phonon heat transfer theory and percolation theory,the influence of the structure of the heat-conducting epoxy resin composite and the dispersion state of the heat-conducting filler on their heat-conducting performance were discussed.The future research directions of heat-conducting epoxy resins in microelectronic materials and aerospace applications were also expected.
分 类 号:TQ323.5[化学工程—合成树脂塑料工业]
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