阻焊掉油改善探讨  

Discussion on improvement of solder-resist off

作　　者：邓松林 林映生 陈春 胡光辉[1,2,3] 李光平 余卫宇[1,2,3] Deng Songlin;Lin Yingsheng;Chen Chun;Hu Guanghui;Li Guangping;Yu Weiyu

机构地区：[1]惠州市金百泽电路科技有限公司,广东惠州516083 [2]广东工业大学,广东广州510006 [3]华南理工大学,广东广州510641

出　　处：《印制电路信息》2020年第4期27-30,共4页Printed Circuit Information

摘　　要：本文探讨了阻焊掉油的影响因子,通过阻焊的流程分析锁定改善的范围,分析确定主要影响因子,利用主要的影响因子设计DOE试验,确定最佳的生产参数,从而稳定生产制程,保证生产品质。This paper studies the influence factors of solder-resist off.The range of improvement is analyzed by the process of solder mask.The main influence factors are determined through relevant test analysis.DOE test is designed by using the main influence factors.The best production parameters,so as to stabilize the production process,ensure the production quality,and make the products meet the customer requirements.

关 键 词：前处理 塞孔 阻焊剂 固化 

分 类 号：TN41[电子电信—微电子学与固体电子学]