PCB微孔成孔技术的现状  

Current status of PCB micro-via processing technology

作　　者：杨宏强 Yang Hongqiang(Shanghai Unifree Electronic Technology Co.,Ltd.,Shanghai 201302,China)

机构地区：[1]上海尚容电子科技有限公司,上海201302

出　　处：《印制电路信息》2020年第4期31-38,共8页Printed Circuit Information

摘　　要：随着PCB上的孔越来越密,技术难度越来越大,成孔技术越来越重要。针对此,从物料(原理)、工艺和质量三方面详细研究了目前应用最为广泛的三种PCB微孔加工技术(机械钻孔、CO2激光成孔、UV激光成孔)的特点、现状。PCB micro-via processing technology is more important than before with the denser quantity and the more difficult technology of micro-via.Aiming at this situation,the paper studies characterization,current status,and development trends of PCB micro-via processing technology,including mechanical drilling,CO2&UV laser processing based on its material(or,principle),processing and quality,which are the most extensive application technology in themicro-via processing technology.

关 键 词：微孔 机械钻孔 CO2激光成孔 UV激光成孔 

分 类 号：TN41[电子电信—微电子学与固体电子学]