多层刚挠结合板层压质量改善  

The improvement of laminating quality of multi-layer rigid-flex PCB

作　　者：林映生 张伟伟 石学兵 潘湛昌 胡光辉[1,2] Lin Yinsheng;Zhang Weiwei;Shi Xuebin;Pan Shenchang;Hu Guanghui

机构地区：[1]惠州市金百泽电路科技有限公司,广东惠州516083 [2]广东工业大学,广东广州510006

出　　处：《印制电路信息》2020年第4期39-42,共4页Printed Circuit Information

摘　　要：对于多层软板(≥12层)刚挠结合板按传统工艺制作面临软板起皱、层压白斑等缺陷;本文介绍了一种多层(2R+16F+2R)刚挠结合板层压工艺改进方法,通过优化软板厚度,覆盖膜开窗工艺,对比不同PP胶流量等,有效的改善了多层刚挠结合板挠性区起皱、层压白斑、板面不平等品质不良,为后续多层刚挠结合板量产奠定良好的基础。For the multi-layer rigid-flex PCB more than 12,the traditional prosses is faced with defects such as flexible board wrinkling and lamination white spot.In this paper,an improvement lamination process for multi-layer rigid-flex PCB is introduced,with the number of flexible board layer over 16.Through optimizing the flexible board thickness,covering film windowing process,and comparing the flow of different PP adhesive,the poor quality such as flexible board wrinkling,laminated white spot,surface uneven,were effectively improved.It lays a good foundation for the subsequent mass production of multi-layer rigid-flex PCB.

关 键 词：多层刚挠结合板 层压质量 软板厚度 覆盖膜开窗 

分 类 号：TN41[电子电信—微电子学与固体电子学]