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作 者:张瑄珺[1,2,3,4] 沈佳骏 王健超 Zhang Xuanjun;Shen Jiajun;Wang Jianchao(Shanghai Institute of Laser Technology,Shanghai 200233,China;Shanghai Key Laboratory of Laser Beam Micro-Processing,Shanghai 200233,China;Shanghai Engineering Research Center of Laser Intelligence Manufacturing,Shanghai 200233,China;Shanghai Engineering Research Center of Laser Direct Parts Marking Traceability,Shanghai 200233,China)
机构地区:[1]上海市激光技术研究所,上海200223 [2]上海市激光束精细加工重点实验室,上海200233 [3]上海激光智能制造工程技术研究中心,上海200233 [4]上海激光直接物标溯源工程技术研究中心,上海200233
出 处:《应用激光》2020年第1期86-90,共5页Applied Laser
基 金:上海市科委资助项目(项目编号:18511109100)。
摘 要:采用不同波长皮秒激光器在碳纤维复合材料板材上进行制孔加工,研究了不同波长(532,355 nm)、扫描速度(3 000、3 500、4 000、4 500、5 000 mm/s)、加工缝宽(0.4、0.5、0.6 mm)对加工孔表面热影响区、孔锥度、加工时长等加工质量的影响。结果表明:激光波长越短,加工孔的表面质量越好,热影响区越小。在5 mm厚的碳纤维板材上加工直径为3 mm的孔,当激光波长为532 nm时,加工孔边缘热影响区大小为200μm;当激光波长为355 nm时,加工孔边缘热影响区大小为70μm。在不影响加工效率的前提下,一定范围内,加工速度越大越好,缝宽越小越好。当扫描速度为5 000 mm/s、加工缝宽为0.4 mm时,表面孔边缘热影响区大小仅为33.8μm,其孔径上下表面差为184.1μm,均为以上所有参数条件下最好效果。Drilling experiments of Carbon Fiber Reinforced Plastic(CFRP) plates by using different wavelengths picosecond lasers were carried out. The effects of different wavelengths(532, 355 nm), processing speeds(3 000, 3 500, 4 000, 4 500, 5 000 mm/s) and processing widths(0.4, 0.5, 0.6 mm) on surface heat affected zone, hole taper and processing time were investigated. The results show that the shorter the laser wavelength, the smaller the heat affected zone, and the better the surface quality of the hole. Holes with diameter of 3 mm were processed on a 5 mm thick CFRP plates. The size of the heat affected zone(HAZ) at the edge of the hole was 200 μm, corresponding to a laser wavelength of 532 nm. The size of the HAZ at the edge of the hole was 70 μm, corresponding to a laser wavelength of 355 nm. The processing quality could be improved by increasing the processing speed, decreasing the seam processing width. The scanning speed of 5000 mm/s and the processing width of 0.4 mm, are the optimal parameters, corresponding to size of HAZ at the edge of the hole surface of 33.8μm, the difference in diameter between the upper and lower surfaces of the hole of 184.1 μm.
分 类 号:TN249[电子电信—物理电子学]
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