PCB布线中电流生热的仿真与实践  

Simulation and Practice of Current Heat Generation in PCB Cabling

作　　者：李长民 任立立[1] 邵明亮[1] Li Chang-min;Ren Li-li;Shao Ming-liang(ZTE Corporation,Hebei Langfang 065201)

机构地区：[1]中兴通讯股份有限公司,河北廊坊065201

出　　处：《电子质量》2020年第5期132-134,139,共4页Electronics Quality

摘　　要：该文总结了一种PCB布线中电流生热的仿真方法,在已知PCB走线电流大小的情况下,计算铜皮电阻继而通过焦耳热得到铜皮的发热量,并设计了一个实验,对比仿真和实测的差距,结果显示测试和仿真的温度值很接近,证明这种电流生热的仿真方法是准确而有效的。This paper summarizes a simulation method of current heat generation in PCB cabling.If the current of PCB cabling is known,the resistance of the copper sheet can be calculated and then the heat generation of the copper sheet can be obtained through Joule heat.An experiment is designed to compare the difference between the tested temperature and simulated temperature.The result shows that the temperature value of the test and the simulated temperature value is close to that of the tested one,which proves that the simulation method of current heat generation is accurate and effective.

关 键 词：热仿真 FLOTHERM PCB布线 电流 温度 

分 类 号：TN41[电子电信—微电子学与固体电子学]