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作 者:李泽峰 欧阳八生[1] LI Zefeng;OUYANG Basheng(College of Mechanical Engineering, University of South China, Hengyang 421000 ,China)
出 处:《激光技术》2020年第3期358-363,共6页Laser Technology
摘 要:为了解决传统印刷电路板(PCB)中定位标识圆(Mark圆)的检测精度和准确率不高的问题,采用曲线拟合及优化拟合算法改善Mark圆检测方式并进行了理论分析,通过使用微软基础类库嵌入标准的机器视觉算法包HALCON的方法搭建检测平台并进行了实验验证。结果表明,该方法检测成功率可达97%,检测精度在0.3pixel以下,检测时间小于100ms,解决了传统PCB中Mark圆检测精度不高的问题,同时大量测试数据显示,在图像发生平移、旋转、缩放的环境下,仍能保证较好的检测效果。该研究对实际PCB生产检测具有一定借鉴意义。In order to solve the problem of low detection accuracy of Mark circle in traditional printed circuit board(PCB),the curve fitting and optimized fitting algorithm were used to improve the Mark circle detection mode,and the theoretical analysis was carried out.The test platform was built by using microsoft foundation classes(MFC)to embed the standard machine vision algorithm package HALCON for experimental verification.The results showes that the success rate of the method was 97%,the detection accuracy was less than 0.3pixel,and the detection time was less than 100ms.It solved the problem of low accuracy of Mark circle in traditional PCB.At the same time,a large number of test data showed that it could still ensure a good detection effect in the environment where the image was panned,rotated,and zoomed.This research has certain reference to the actual PCB production detection.
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