Sn-37Pb焊球与Ni/NiP UBM界面反应特性研究  

Study on Interfacial Reaction between Sn-37Pb Solder Ball and Ni/NiP UBM

作　　者：田飞飞 刘清君[1] 李勇[3] TIAN Feifei;LIU Qingjun;LI Yong(College of Biomedical Engineering and Instrumentation Science,Zhejiang University,Hangzhou,310000,CHN;Nanjing Electronic Devices Institute,Nanjing,210016,CHN;China ElectronicTechnology Deqing Huaying Electronic Co.,Ltd.,Deqing,Zhejiang,313200,CHN)

机构地区：[1]浙江大学生仪学院,杭州310000 [2]南京电子器件研究所,南京210016 [3]中电科技德清华莹电子有限公司,浙江德清313200

出　　处：《固体电子学研究与进展》2020年第2期154-158,共5页Research & Progress of SSE

摘　　要：通过对共晶锡铅焊球与Ni/NiP UBM层扫描电镜界面微观组织观察和成分分析,研究了Sn-37Pb/Ni和Sn-37Pb/NiPUBM焊点界面反应特性。研究表明芯片侧界面IMC由Ni层到焊料的顺序为:靠近Ni层界面化合物为(Ni,Cu)3Sn,靠近焊料侧化合物为(Cu,Ni)6Sn5;PCB板侧界面IMC包括靠近NiP层的NiSnP化合物和靠近焊料侧的(Cu,Ni)6Sn5化合物,NiSnP是由于Ni的扩散形成。PCB板侧NiP镀层中存在微裂纹缺陷,此裂纹缺陷会导致金属间化合物中产生裂纹,从而对焊点力学性能和可靠性产生不良的影响。Through investigation on the scanning electron microscope(SEM)interfacial microstructure and compositional analysis of eutectic Sn-37 Pb solder and Ni/NiP UBM,the properties of interfacial reaction between Sn-37 Pb/Ni and Sn-37 Pb/NiP on solder joints were studied systematically.The results show the formed IMCs are(Ni,Cu)3 Sn and(Cu,Ni)6 Sn5 in order from Ni UBM to the Sn-37 Pb solder on the chip side,and the formed IMCs are ternary NiSnP phase and(Cu,Ni)6 Sn5 in order from NiP UBM to the Sn-37Pb solder on the PCB side.There exited crack defects in NiP UBM layer,which can propagated into IMC layer and have unfavourable effect on mechanical property and reliability of the solder joint.

关 键 词：共晶锡铅焊球 UBM层 界面反应 

分 类 号：TG146[一般工业技术—材料科学与工程]