片式钽电容器二氧化锰层固有批次性质量缺陷失效分析  

Failure Analysis of Inherent Batch Quality Defects in Manganese Dioxide Layer of Chip Tantalum Capacitor

作　　者：李娟[1] 李春 朱敏蔚 孔泽斌 祝伟明[1] Li Juan;Li Chun;Zhu Minwei;Kong Zebin;Zhu Weiming(No.808 Institute of Shanghai Academy of Spaceflight Technology,Shanghai 201109,China)

机构地区：[1]上海航天技术研究院第八〇八研究所,上海201109

出　　处：《质量与可靠性》2020年第2期22-25,30,共5页Quality and Reliability

摘　　要：对一起由于片式钽电容器二氧化锰层固有质量缺陷引起的批次性质量问题进行深入分析,结果显示钽芯周围阴极二氧化锰层质量结构上存在规律性分布不均,会导致产品加电、断电过程中冲击电流向钽芯底面顶点位置集中而引发失效,该案例反映出目前片式钽电容器业内在阴极二氧化锰层控制上还存在盲区,结合已有的剖面数据和目前行业制造水平对二氧化锰层控制要求进行了初步给定,但由于尚缺乏系统二氧化锰层可靠性研究数据,故业内厂家仍需进一步优化工艺参数,累积可靠性数据,完备工艺控制和质量控制方法。In this paper,a batch quality problem caused by the failure of CAK45C chip type solid tantalum capacitor is analyzed in depth.The results show that the quality structure of the cathode manganese dioxide layer around the tantalum core is existence of regular unevenly distributed,which will cause the impact current to concentrate to the vertex of the tantalum core bottom surface during the power-on and power-off processes of the product and lead to a failure.This case reflects that there still is a blind area in the control of cathode manganese dioxide layer in the current chip tantalum capacitor industry.Based on the existing profile data and the current manufacturing level of the industry,this paper gives a preliminary definition of the quality control of dioxide layer.However,due to the lack of systematic manganese dioxide layer reliability research data,the industry manufacturers still need to further optimize process parameters,to accumulate reliability data,and to complete process control and quality control methods.

关 键 词：片式钽电容器 失效分析 电应力集中 二氧化锰层 质量控制 

分 类 号：V467[航空宇航科学与技术—航空宇航制造工程]