细长铜管内壁化学流镀镍-磷合金工艺的研究  

Study on Flow Electroless Plating Ni-P Alloy on Inner Wall of Thin Copper Tube

作　　者：薛伯生 XUE Bosheng(CRRC Qishuyan Institute Co.,Ltd.,Changzhou 213011,China)

机构地区：[1]中车戚墅堰机车车辆工艺研究所有限公司,江苏常州213011

出　　处：《电镀与环保》2020年第3期33-34,共2页Electroplating & Pollution Control

摘　　要：介绍了细长铜管内壁化学流镀镍-磷合金工艺。探讨了铜及其合金化学镀镍触发时间的影响因素。研究了铜管内壁溶液流速与沉积速率的关系。Flow electroless plating Ni-P alloy on inner wall of thin copper tube was introduced,and the factors affecting the triggering time of electroless nickel plating on copper and its alloys were discussed.The relationship between the velocity of solution in inner wall of copper pipe and deposition rate was studied.

关 键 词：铜及其合金 化学镀镍 流镀 

分 类 号：TQ153[化学工程—电化学工业]