超声诱导瞬间液相焊焊接以Ag-28Cu为中间层的过共晶Al-Si合金  

Hypereutectic Al-Si Alloys with Ag-28Cu Interlayer Jointed by Ultrasound-induced Transient Liquid Phase Bonding

作　　者：何朝成 付玉 王谦[1] 韩俭 陈胜勇 闫久春[3] HE Chaocheng;FU Yu;WANG Qian;HAN Jian;CHEN Shengyong;YAN Jiuchun(School of Materials Science and Engineering,Tianjin University of Technology,Tianjin 300384;School of Computer Science and Engineering,Tianjin University of Technology,Tianjin 300384;State Key Laboratory of Advanced Welding and Joining,Harbin Institute of Technology,Harbin 150001)

机构地区：[1]天津理工大学材料科学与工程学院,天津300384 [2]天津理工大学计算机科学与工程学院,天津300384 [3]哈尔滨工业大学先进焊接与连接国家重点实验室,哈尔滨150001

出　　处：《机械工程学报》2020年第8期107-112,共6页Journal of Mechanical Engineering

基　　金：国家自然科学基金资助项目(51504165)。

摘　　要：在大气环境中,应用超声诱导瞬间液相焊的方法,焊接以Ag-28Cu为中间层的Al-50Si合金。研究了超声振动时间、焊接温度对接头微观结构演变和Si颗粒迁移的影响。分析了Si颗粒增强的完全固溶体接头的快速形成过程。阐述了剪切强度与超声振动时间和接头组织之间的关系。在520℃焊接温度下,超声振动仅3s,接头发生了界面冶金结合。超声振动15s时,获得了Si颗粒增强的完全固溶体接头。焊接温度对Ag、Cu和Al之间的相互扩散产生影响。随着温度的增加,原子扩散加快。由于超声在固-液体介质中的效应,使得基体金属与中间层表面的氧化膜得到快速破除,基体金属与中间层产生元素扩散。当扩散达到一定浓度时,基体金属与中间层发生冶金反应,形成Al-Ag-Cu三元共晶液相,并且Si颗粒迁移进三元共晶液相中。随着超声振动时间延长,在超声振动、压力作用下,三元共晶合金减少,直至完全消失,剩余的Al(Ag,Cu)固溶体保留在焊缝中,焊缝闭合,获得了Si颗粒增强的完全固溶体接头。Si颗粒的迁移和三元共晶合金的挤出影响接头的剪切强度。剪切强度随超声振动时间的延长而增加。超声振动15s的剪切试样,其断裂发生在基体金属侧,属于韧性断裂,接头剪切强度最高,达到约123MPa。In the atmosphere,ultrasound-induced transient liquid phase bonding is used to join Al-50 Si alloy with Ag-28 Cu as the interlayer.The effects of ultrasonic vibration time and joining temperature on microstructure evolution and Si particle migration of solder joints are studied.The rapid formation process of Si particle reinforced complete solid solution joints is analyzed.The relationship between shear strength and ultrasonic vibration time and joint microstructure is described.The interface metallurgical bonding is occurred by ultrasonic vibration for only 3 s at 520℃,and Si particle-reinforced complete solid solution joint is obtained by ultrasonic vibration for 15 s.The joining temperature affected the interdiffusion between Ag,Cu and Al.As the joining temperature increases,the atomic diffusion accelerates.Due to the effect of ultrasound in the solid-liquid medium,the surface oxide film between the base metal and interlayer is rapidly broken,and the element diffusion between the base metal and interlayer occurred.When the diffusion reaches a certain concentration,a metallurgical reaction occur,an Al-Ag-Cu ternary eutectic liquid phase is formed,and the Si particles migrate into the ternary eutectic liquid phase.With the ultrasonic vibration time prolongs,under the action of ultrasonic vibration and pressure,the ternary eutectic alloy decreases until it disappeared completely,the remaining Al(Ag,Cu)solid solution remained in the solder joint,the solder joint is closed,and the Si particle-reinforced complete solid solution joint is obtained.The migration of Si particles and ternary eutectic alloy affects the shear strength of the joint,and the shear strength increases with the ultrasonic vibration time.The sheared sample with an ultrasonic vibration time of 15 s,whose fracture occurred in the base metal and belonged to a ductile fracture,and the joint has the highest shear strength of about 123 MPa.

关 键 词：超声 AL-SI Si颗粒 固溶体 三元共晶 剪切强度 

分 类 号：TG456[金属学及工艺—焊接]