基于硅光MZ调制器的光电混合集成发射机设计  

Design of Electronic-PhotonicHybrid Integrated Transmitter Based on Silicon-Photonic MZ Modulator

作　　者：王浩正 纪鹏飞 何卫峰[1] Wang Haozheng;Ji Pengfei;He Weifeng(Department of Micro-Nano Electronics,Shanghai Jiao Tong University Shanghai 200240,China)

机构地区：[1]上海交通大学微纳电子学系,上海200240

出　　处：《信息通信》2020年第3期1-4,共4页Information & Communications

摘　　要：在高速硅光互连系统中,基于键合线的光电混合集成方式具有低成本、高灵活性特点而得到广泛应用。但是,键合线的寄生效应会带来高速信号的反射和阻抗匹配等问题,成为混合集成发射机中设的难点。基于多通道硅光Mach–Zehnder调制器结构,设计了一种基于金线键合的光电混合集成方案,并针对其中键合线寄生效应问题,在开发了键合线模型的基础上提出了寄生效应的补偿方法,并最终设计实现了一款4通道的光电混合集成发射机。仿真和实验证明,该方法能够改善由键合线引起的信号反射问题,使得键合金线的损耗从1.55dB降低至0.75dB,并能够实现每通道25Gb/s的速率的高速互联。In the high-speed silicon-photonics interconnection system,the hybrid integration method based on bonding wire is widely used because of its low cost and high flexibility.However,the parasitic effect of the bonding wire will bring high-speed signal reflection and impedance matching problems,which become the difficulty in the design of hybrid integrated transmitter.Based on the structure of multichannel silicon photonics Mach Zehnder modulator,a scheme of photoelectric hybrid integration based on gold wire bonding is designed.Aiming at the parasitic effect of bonding wire,a compensation method of parasitic effect is proposed based on the development of bonding wire model,and finally a 4-channel photoelectric hybrid integrated transmitter is designed and implemented.Simulation and experiment show that this method can improve the signal reflection caused by bonding wire,reduce the loss of bonding alloy wire from 1.55 db to 0.75 db,and realize the high-speed interconnection of 25 Gb/s per channel.

关 键 词：硅光互连 马赫曾德调制器 调制器驱动 光电集成 键合线补偿 

分 类 号：TN913.7[电子电信—通信与信息系统]