基于LabVIEW的Sn-Bi合金定量金相分析系统  

Quantitative Metallography Analysis System of Sn-Bi Alloy Based on LabVIEW

作　　者：王磊[1] 董妍 张宁[1] 张磊[1] 宋彬 Wang Lei;Dong Yan;Zhang Ning;Zhang Lei;Song Bin(Department of Mechanical and Electrical Engineering,Xuzhou Institute of Technology)

机构地区：[1]徐州工程学院机电工程学院,江苏徐州221008

出　　处：《特种铸造及有色合金》2020年第5期576-580,共5页Special Casting & Nonferrous Alloys

基　　金：江苏省高等学校自然科学研究重大资助项目(19KJA140002);徐州市重点研发计划资助项目(KC17007);徐州市科技合作资助项目(KC17225);徐州工程学院校科研资助项目(XKY2017227)。

摘　　要：Sn-Bi合金微观组织形貌中Bi相的晶粒尺寸、数量、形状等特征参数对焊料的力学性能和焊接性能有较大影响,有必要对其进行定量分析。在LabVIEW平台下开发了金相图像的增强、滤波、阈值分割等预处理程序,并实现了金相组织的颗粒度、占比、轴长等参数的统计分析。结果表明,该系统能够快速、高效地对Sn-Bi合金及其他材料的金相组织进行筛选和定量分析,为焊料的韧化机制研究提供参考。The grain size, quantity, shape and other characteristic parameters of Bi phase in the microstructure of Sn-Bi alloy have great influence on the mechanical properties and welding properties of solder, so it is necessary to carry out quantitative analysis. The preprocessing program of metallographic such as image enhancement, filtering and threshold segmentation was developed under the LabVIEW platform, and the statistical analysis of the particle size, ratio and axial length of the metallographic structure was realized. The results show that the system can screen quickly and efficiently and analyze quantitatively the microstructure of Sn-Bi alloy and other materials, providing a reference for the research of toughening mechanism of solder.

关 键 词：锡铋合金 图像处理 金相分析 LABVIEW 

分 类 号：TG146.14[一般工业技术—材料科学与工程]