元器件引脚间距与焊膏印刷精度的关系分析  

Analysis of Relationship between Component Lead Pitch and Solder Paste Printing Precision

作　　者：曹捷[1] 张国琦[1] CAO Jie;ZHANG Guoqi(Xi'an Institute of Optics and Precision Mechanics,Chinese Academy of Sciences,Xi'an 710119,China)

机构地区：[1]中国科学院西安光学精密机械研究所,陕西西安710119

出　　处：《电子工艺技术》2020年第3期142-145,共4页Electronics Process Technology

基　　金：陕西省重点研发计划项目(2017ZDCXL-GY-11-02-01)。

摘　　要：半个世纪以来,集成电路的发展基本遵循摩尔定律。随着集成电路功能的增强,元件封装后的引脚增多,引脚间距缩小,QFP引脚中心距最小可达0.3 mm。PCB板的爬电距离要符合国家标准的相关条款要求,最小爬电距离为0.025 mm。相应的SMT工艺中焊膏印刷精度不断提高。就元件引脚间距的变化对焊膏印刷精度的关系进行分析,最后给出满足高精度焊膏印刷的技术解决方案。For half a century,the development of integrated circuits has followed Moore's law.With the enhancement of integrated circuit functions,the number of pins after component packaging increases,the lead pitch decreases.The center distance of QFP pin can reach a minimum of 0.3 mm.The creepage distance of PCB should comply with relevant provisions of the national standard,and the minimum creepage distance should be 0.025 mm.In the corresponding SMT process,the precision of solder paste printing is continuously improved.The relationship between solder paste printing precision and the change of component lead pitch is analyzed.Finally,a technical solution to meet the requirement of high-precision solder paste printing is put forward.

关 键 词：集成电路 爬电距离 焊膏印刷 印刷偏差 机器视觉 

分 类 号：TN605[电子电信—电路与系统]