系统结构状态对微小芯片贴片精度的影响  

Influence of System Structure State on Micro Chip Placement Precision

作　　者：侯一雪 王敏 HOU Yixue;WANG Min(The 2nd Research Institute of CETC,Taiyuan 030024,China)

机构地区：[1]中国电子科技集团公司第二研究所,山西太原030024

出　　处：《电子工艺技术》2020年第3期146-149,共4页Electronics Process Technology

基　　金：装备发展支撑项目基金。

摘　　要：芯片贴片技术是微电子元器件封装工艺流程中的第一道工序,是后道封装工艺的基础。随着微电子芯片设计技术及元器件设计技术的发展,芯片尺寸已经微型化,对贴片工艺提出了更高要求。全自动贴片设备是解决此工艺问题的主要工艺设备。高精度自动拾放技术是全自动贴片设备的核心技术,从全自动贴片设备系统结构状态的角度分析了影响微小芯片贴片精度的几个要点。The high-precision chip bonding technology is the first step in the packaging process of microelectronics assembling.It's the base function and core technology.With the development of microelectronic chip design technology and component design technology,the chip size has been miniaturized,which puts forward higher requirements for chip bonding.Fully Automatic Chip Bonder is the main process equipment to solve this problem.High precision automatic picking and placing technology is the core technology of the Fully Automatic Chip Bonder.From the point of view of system structure,several aspects affecting the precision of microchip placement are pointed out and analyzed.

关 键 词：微小芯片 拾放技术 贴片精度 全自动贴片设备 

分 类 号：TN405[电子电信—微电子学与固体电子学]