高压功率放大器水冷散热结构设计及仿真  

Design and Simulation of Water Cooled Heat Dissipation Structure for High Voltage Power Amplifier

作　　者：底红岩 张红彩[1] 张巧寿[1] 张奎华[1] DI Hong-yan;ZHANG Hong-cai;ZHANG Qiao-shou;ZHANG Kui-hua(Beijing Institute of Structure and Environment Engineering,Beijing 100076,China)

机构地区：[1]北京强度环境研究所,北京100076

出　　处：《电力电子技术》2020年第6期75-77,82,共4页Power Electronics

摘　　要：随着振动台技术的发展,与之配套的功率放大器输出功率越来越高。针对快速发展的高压功率放大器,如何提高单位体积的输出功率并保证高压功率放大器能够安全可靠工作是目前高压功率放大器迫切需要解决的问题。在此设计了一种新型的散热结构,大大提高了高压功率放大器的散热效率。采用FLUENT有限元分析软件对水冷散热器的温度场及流场进行了仿真分析,并对水冷散热结构以及仿真结果进行了试验验证,结果表明,该散热结构大大提高了功率放大器单位体积的输出功率,而且采用FLUENT有限元分析的方法可以为设计以及改进散热器结构提供理论依据。With the development of shaking table technology,the matching power amplifier output power is getting higher and higher.For the rapid development of high-voltage power amplifier,how to improve the output power per unit volume and to ensure high-voltage power amplifier can be safe and reliable work is the urgent need for high-voltage power amplifier to solve the problems.A new type of heat dissipation structure is designed,greatly improving the heat dissipation efficiency of high-voltage power amplifier.The temperature field and flow field of the water cooled radiator are simulated by FLUENT finite element analysis software,and the water cooled heat dissipation structure and the simulation results are tested and verified.The results show that this kind of heat dissipation structure greatly improves the output power per unit volume of the power amplifier,and the method of FLUENT finite element analysis can provide the theoretical basis for the design and improvement of the radiator structure.

关 键 词：功率放大器 散热器 高压 

分 类 号：TN722[电子电信—电路与系统]