温度响应型压敏胶粘带的制备及性能研究  

Study on Preparation and Properties of the Temperature-responsive Pressure-sensitive Adhesive Tape

作　　者：金晨[1] 卞状状 吴同壮 Jin Chen;Bian Zhuangzhuang;Wu Tongzhuang(Suzhou Chien-Shiung Institute of Technology, Jiangsu Taicang 215411.)

机构地区：[1]苏州健雄职业技术学院,江苏太仓215411

出　　处：《化工时刊》2020年第5期1-4,共4页Chemical Industry Times

基　　金：太仓市应用基础研究计划项目(TC2010YYJC08)。

摘　　要：采用溶液聚合法合成了一款丙烯酸酯胶粘剂,并通过在反应体系中加入热膨胀材料,制备了具有温度响应性的压敏胶粘带。随后探索了影响温度响应效果的因素,通过优化实验条件发现,当w固化剂=1.0%,w微囊=1.5~2.0%时,胶粘带温度响应性最佳。加热后,胶粘带可从被贴物上自行剥离且被贴物表面无污染和损伤,特别适用于微型电子元器件表面的临时保护。A kind of acrylate adhesive was synthesized by solution polymerization,and the temperature-responsive pressure-sensitive adhesive tape was prepared by adding thermal expansion material into the reaction system.The factors influencing the temperature response were then explored.Through optimizing the experimental conditions,it was found that when wcuring agent=1.0%,wmicrocapsule=1.5~2.0%,the temperature response of adhesive tapes was the best.After heating,the adhesive tape can peel off from the adherend by itself and the surface of the adherend is free of pollution and damage.This kind of tape is especially suitable for temporary protection of the surface of the micro electronic components.

关 键 词：聚合 温度响应性 压敏胶 保护胶粘带 

分 类 号：TQ4[化学工程]