基于封装集成的四通道微波光子电/光转换组件  

Four channel microwave photons electro-optical conversion module based on package integration

作　　者：蔡雪芳 吕晓萌 廖翱 伍艺龙 景飞 王超 张童童 许玮华 赵炳旭 龙敏慧 CAI Xuefang;LYU Xiaomeng;LIAO Ao;WU Yilong;JING Fei;WANG Chao;ZHANG Tongtong;XU Weihua;ZHAO Bingxu;LONG Minhui(The 29th Research Instiute of CETC,Chengdu 610029,China)

机构地区：[1]中国电子科技集团公司第二十九研究所,成都610029

出　　处：《光通信技术》2020年第6期32-35,共4页Optical Communication Technology

摘　　要：在现有的微波光子系统中,低成本、高性能和阵列化的电/光转换组件成为了限制微波光子应用的技术瓶颈之一。设计了一种基于光电混合封装技术的四通道直调电/光转换组件,该组件集成了多种功能芯片,实现了将四通道2~18 GHz的射频信号转换为光信号的功能。测试结果表明:该组件实现了18 GHz的电光调制带宽、9 dB的插入损耗、小于30 dB的噪声系数以及大于10 dBm的输入三阶截交点(IIP3);在保证高性能电/光转换的同时,有效缩减封装尺寸、降低系统重量和提高系统集成度,有利于微波光子技术的阵列化应用。In the existing microwave photons system,low-cost,high-performance and arrayed electro-optic conversion components become one of the technical bottlenecks that restrict the application of microwave photons.A four channel direct modulation electro-optic conversion module based on photoelectric hybrid packaging technology is designed.The module integrates a variety of functional chips and realizes the function of converting four channels of 2~18 GHz radio frequency signals into optical signals.The test results show that the module achieves 18 GHz electro-optic modulation bandwidth,9 dB insertion loss,less than 30 dB noise coefficient and more than 10 dBm input third order intersection3(IIP3).While ensuring high-performance electro-optical conversion,it can effectively reduce package size,reduce system weight and improve system integration,which is conducive to the array application of microwave photons technology.

关 键 词：微波光子 微波光子混合集成 电/光转换 高速直接调制 

分 类 号：TN929.1[电子电信—通信与信息系统]