微量Ga对SAC305锡球真圆度和色差的影响  

Effect of Trace Ga on Roundness and Color Difference of SAC305 Solder Ball

作　　者：任晓飞 闫焉服[1] 李超君 纠永涛 REN Xiaofei;YAN Yanfu;LI Chaojun;JIU Yongtao(Materials Science&Engineering School,Henan University of Science&Technology,Luoyang 471023,China;Zhengzhou Research Institute of Mechanical Engineering Co.,Ltd.,Zhengzhou 450001,China)

机构地区：[1]河南科技大学材料科学与工程学院,河南洛阳471023 [2]郑州机械研究所有限公司,河南郑州450001

出　　处：《河南科技大学学报（自然科学版）》2020年第6期6-10,M0002,共6页Journal of Henan University of Science And Technology:Natural Science

基　　金：国家自然科学基金项目(51175151);河南省杰出青年基金项目(144100510002)。

摘　　要：针对Sn3.0Ag0.5Cu钎料抗氧化性差的问题,通过添加微量Ga元素,形成抗氧化合金来改善钎料的抗氧化性。分析了Ga元素质量分数为0%~0.10%时, Sn3.0Ag0.5Cu锡球(简称SAC305锡球)真圆度和色差的变化。研究结果表明:随着Ga元素质量分数的增加,锡球真圆度先减小后增加,Ga元素质量分数为0.07%时,锡球真圆度最小,为4.5×10-3,锡球成形度最好。锡球色差随Ga元素质量分数的增加,先增加后减小, Ga元素质量分数为0.05%时,锡球色差最大,为75.02NBS。基于微量Ga元素对SAC305锡球真圆度和色差的影响,Ga元素质量分数取0.05%~0.07%为宜。To solve the problem of poor oxidation resistance of Sn3.0Ag0.5Cu solder,trace amount of Ga element(0%~0.10%)was added to prepare antioxidant alloy to improve the oxidation resistance.The roundness and chromatic aberration of Sn3.0Ag0.5Cu ball(abbreviated as SAC305 solder ball)was investigated.The results show that the roundness of the solder ball showes a trend of decreasing first and then increasing with the increase of Ga element mass fraction,and reaches a minimum value of 4.5×10-3 when Ga element mass fraction is 0.07%.Meanwhile,the solder ball formability is the best.The SAC305 chromatic aberration showes a trend of increasing first and then decreasing with the increase of Ga element mass fraction,and reaches the maximum value of 75.02NBS when the Ga element mass fraction is 0.05%.Considering comprehesively the effect of trace Ga on the roundness and chromatic aberration of SAC305 solder balls,the mass fraction of Ga element is preferably 0.05%~0.07%.

关 键 词：SAC305 真圆度 色差 氧元素质量分数 

分 类 号：TG425[金属学及工艺—焊接]