含芳杂环结构的聚酰亚胺/SiO2杂化薄膜及性能研究  

Study on Polyimide/SiO2 Hybrid Films with Aromatic Heterocycles Ring and Their Properties

作　　者：游茜 YOU Xi

机构地区：[1]上海市塑料研究所有限公司,上海201702

出　　处：《上海化工》2020年第3期10-14,共5页Shanghai Chemical Industry

摘　　要：以均苯四甲酸二酐(PMDA)为二酐单体,对苯二胺(p-PDA)、2-(4-氨基苯基)-5-氨基苯并噁唑(BOA)和2-(4-氨基苯基)-5-氨基苯并咪唑(BIA)为二胺单体,制备了聚酰亚胺(PI)树脂和薄膜,又采用三辊机制备了PI/SiO2杂化树脂和薄膜。利用傅里叶红外光谱对材料的结构进行了表征,结果表明薄膜完全亚胺化,且SiO2存在于PI基体中。此外,还研究了PI和PI/SiO2杂化薄膜的热学性能和力学性能。随着2种不同粒径SiO2的加入,PI/SiO2杂化薄膜的耐热性能得到明显改善。与纯PI相比,PI/SiO2杂化薄膜的玻璃化转变温度上升3~16℃,1%热失重温度提高了14~30℃,而且线性热膨胀得到抑制,PI-R106-5的线性热膨胀系数(CTE)仅为2.59×10-6/℃。但是,PI/SiO2杂化薄膜的力学性能相对于纯PI薄膜有所降低,未来应继续提高其相容性。Polyimide(PI)resin and film were prepared by using pyromellitic dianhydride(PMDA)as dianhydride monomer and p-phenylenediamine(p-PDA),2-(4-aminophenyl)-5-aminobenzoxazole(BOA)and 2-(4-aminophenyl)-5-aminobenzimidazole(BIA)as diamine monomer.PI/SiO2 hybrid resin and film were also prepared by three-roller mixing method.The materials structures were characterized by Fourier transform infrared spectroscopy(FTIR).The results showed that the film was completely imidized and SiO2 existed in PI matrix.In addition,the thermal and mechanical properties of PI and PI/SiO2 hybrid films were also studied.With the addition of two kinds of SiO2 with different particle sizes,the heat resistance of PI/SiO2 hybrid films were improved obviously.Compared with pure PI,the glass transition temperature of PI/SiO2 hybrid films increased by 3~16℃,the 1%mass loss temperature increased by 14~30℃,and the linear thermal expansion was inhibited.The coefficient of thermal expansion(CTE)of PI-R106-5 was only 2.59×10^-6/℃.However,the mechanical properties of PI/SiO2 hybrid films were lower than those of pure PI films,and their compatibility should be improved in the future.

关 键 词：聚酰亚胺 二氧化硅 杂化薄膜 高耐热 低CTE 

分 类 号：TQ323.7[化学工程—合成树脂塑料工业]