铜合金层蚀刻液专利分析  

Patent Analysis of Copper Alloy Layer Etchant

作　　者：刘化然[1] 闫蕾[1] Liu Huaran;Yan Lei(Patent Examination Cooperation(Beijing)Center of the Patent Office,CNIPA,Beijing 100096,China)

机构地区：[1]国家知识产权局专利局专利审查协作北京中心,北京100096

出　　处：《广东化工》2020年第12期116-117,共2页Guangdong Chemical Industry

摘　　要：本文以德温特专利数据库为基础,通过对专利文献的宏观分析以及对重点申请人的技术分析,对铜合金层蚀刻液的发展现状进行了分析,并提出了相关建议。Based on the Derwent Patents database,the development of copper alloy layer etchant has been analyzed through the Macro analysis and the technical analysis of important applicant,and some suggestions has been made in this paper.

关 键 词：铜合金层 蚀刻液 专利分析 

分 类 号：TQ[化学工程]