智能化可重构硅光集成器件及芯片应用研究  

Applications of Intelligent Reconfigurable Silicon Photonic Devices and Circuits

作　　者：谢意维 张涛[1] 戴道锌[1] XIE Yiwei;ZHANG Tao;DAI Daoxin(Zhejiang University,Hangzhou 310058,China)

机构地区：[1]浙江大学,浙江杭州310058

出　　处：《中兴通讯技术》2020年第2期64-69,共6页ZTE Technology Journal

基　　金：国家重点基础研究发展项目(2018YFB2200200);国家杰出青年基金(61725503);国家自然科学基金(91950205、6191101294、11861121002、61905209);浙江省自然科学基金(LZ18F050001、LD19F050001)。

摘　　要：可重构硅光集成器件和芯片是实现智能化光通信系统的关键技术,其小尺寸、低能耗、低成本、高灵活性等特性为新一代光通信等应用带来了新的发展机遇。总结和讨论了一系列新型热可重构硅光集成器件及芯片,包括可调谐滤波器、光开关代表性功能器件。这些器件及芯片具有设计便捷、工艺简单、兼容等突出优点,被广泛应用于光互连、量子光学和微波光子学等。Reconfigurable silicon photonic devices and chips are key technologies for intelligent optical communication systems.The small size,low energy consumption,low cost,and high flexibility bring new development opportunities for new-generation optical communication applications.We have reviewed and discussed a series of novel thermally-reconfigurable silicon photonic integrated devices and circuits,including reconfigurable optical filter and optical switches,featuring the advantages of easy design and fabrication,which have been widely applied in optical interconnects,quantum photonics and microwave photonics.

关 键 词：硅 可重构 热光效应 光子集成芯片 

分 类 号：TN9[电子电信—信息与通信工程]